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  1. general description the 74hc4020; 74hct4020 are high-spe ed si-gate cmos devices and are pin compatible with the hef4020b series. they are specified in compliance with jedec standard no. 7a. the 74hc4020; 74hct4020 are 14-stage binary ripple counters with a clock input ( cp ), an overriding asynchronous master reset input (mr) and twelve parallel outputs (q0, q3 to q13). the counter advances on the high-to-low transition of cp . a high on mr clears all counter stages and forces all outputs low, independent of the state of cp . each counter stage is a static toggle flip-flop. 2. features ? multiple package options ? complies with jedec standard no. 7a ? specified from ? 40 c to +85 c and from ? 40 c to +125 c 3. applications ? frequency dividing circuits ? time delay circuits ? control counters 4. ordering information 74hc4020; 74hct4020 14-stage binary ripple counter rev. 03 ? 20 january 2010 product data sheet table 1. ordering information type number package temperature range name description version 74hc4020n ? 40 c to +125 c dip16 plastic dual in-line package; 16 leads (300 mil) sot38-4 74hct4020n 74hc4020d ? 40 c to +125 c so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1 74hct4020d 74hc4020db ? 40 c to +125 c ssop16 plastic shrink small outline package; 16 leads; body width 5.3 mm sot338-1 74hct4020db
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 2 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter 5. functional diagram 74hc4020pw ? 40 c to +125 c tssop16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403-1 74hct4020pw 74hc4020bq ? 40 c to +125 c dhvqfn16 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 16 terminals; body 2.5 3.5 0.85 mm sot763-1 74HCT4020BQ table 1. ordering information ?continued type number package temperature range name description version fig 1. functional diagram 001aal20 1 14-stage counter q0 cp 10 t mr 11 c d 9 q3 7 q4 5 q5 4 q6 6 q7 13 q8 12 q9 14 q10 15 q11 1 q12 2 q13 3 fig 2. logic symbol fig 3. iec logic symbol 001aal20 2 q0 9 q3 7 q4 5 q5 4 q6 6 q7 13 q8 12 q9 14 q10 15 q11 1 q12 2 q13 3 11 mr 10 cp 001aal20 3 09 7 5 4 6 ctr14 13 12 14 15 1 2 13 3 11 ct ct = 0 10 +
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 3 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter 6. pinning information 6.1 pinning 6.2 pin description fig 4. logic diagram 001aal20 4 ff 1 rd q cp mr q t ff 2 rd q q t ff 3 rd q q t ff 4 rd q q t ff 6 rd q0 q3 q13 q q t (1) the substrate is attached to this pad using conductive die attach material. it can no t be used as supply pin or input. it is recommended that no connection is made at all. fig 5. pin configuration dip16, so16, ssop16 and tssop16 fig 6. pin configuration dhvqfn16 74hc4020 74hct4020 q11 v cc q12 q10 q13 q9 q5 q7 q4 q8 q6 mr q3 cp gnd q0 001aal205 1 2 3 4 5 6 7 8 10 9 12 11 14 13 16 15 001aal20 6 v cc (1) 74hc4020 74hct4020 q3 cp q6 mr q4 q8 q5 q7 q13 q9 q12 q10 gnd q0 q11 v cc transparent top view 7 10 6 11 5 12 4 13 3 14 2 15 8 9 1 16 terminal 1 index area table 2. pin description symbol pin description q0, q3 to q13 9, 7, 5, 4, 6, 13, 12, 14, 15, 1, 2, 3 output gnd 8 ground (0 v) cp 10 clock input (high-to-low, edge-triggered) mr 11 master reset input (active high) v cc 16 positive supply voltage
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 4 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter 7. functional description [1] h = high voltage level; l = low voltage level; x = don?t care; = low-to-high clock transition; = high-to-low clock transition. 7.1 timing diagram table 3. function table input output cp mr q0, q3 to q13 l no change l count x h l fig 7. timing diagram 001aal207 12 4 8 16 32 64 128 256 512 1024 2048 4096 cp input mr input q0 q3 q4 q5 q6 q7 q8 q9 q10 q11 8192 16384 q12 q13
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 5 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter 8. limiting values [1] for dip16 package: p tot derates linearly with 12 mw/k above 70 c. for so16 package: p tot derates linearly with 8 mw/k above 70 c. for ssop16 and tssop16 packages: p tot derates linearly with 5.5 mw/k above 60 c. for dhvqfn16 package: p tot derates linearly with 4.5 mw/k above 60 c. 9. recommended operating conditions table 4. limiting values in accordance with the absolute maximum rating system (iec 60134). voltages are referenced to gnd (ground = 0 v). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +7 v i ik input clamping current v i < ? 0.5 v or v i > v cc + 0.5 v - 20 ma i ok output clamping current v i < ? 0.5 v or v i > v cc + 0.5 v - 20 ma i o output current ? 0.5 v < v o < v cc + 0.5 v - 25 ma i cc supply current - 50 ma i gnd ground current - 50 ma t stg storage temperature ? 65 +150 c p tot total power dissipation t amb = ? 40 c to +125 c [1] dip16 package - 750 mw so16, ssop16, tssop16 and dhvqfn16 packages - 500 mw table 5. recommended operating conditions symbol parameter conditions 74hc4020 74hct4020 unit min typ max min typ max v cc supply voltage 2.0 5.0 6.0 4.5 5.0 5.5 v v i input voltage 0 - v cc 0 - v cc v v o output voltage 0 - v cc 0 - v cc v t/ v input transition rise and fall rate except for schmitt-trigger inputs v cc = 2.0 v - - 625 - - - ns/v v cc = 4.5 v - 1.67 139 - 1.67 139 ns/v v cc = 6.0 v - - 83 - - - ns/v t amb ambient temperature ? 40 +25 +125 ? 40 +25 +125 c
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 6 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter 10. static characteristics table 6. static characteristics at recommended operating conditions; vo ltages are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c ? 40 c to +85 c ? 40 c to +125 c unit min typ max min max min max 74hc4020 v ih high-level input voltage v cc = 2.0 v 1.5 1.2 - 1.5 - 1.5 - v v cc = 4.5 v 3.15 2.4 - 3.15 - 3.15 - v v cc = 6.0 v 4.2 3.2 - 4.2 - 4.2 - v v il low-level input voltage v cc = 2.0 v - 0.8 0.5 - 0.5 - 0.5 v v cc = 4.5 v - 2.1 1.35 - 1.35 - 1.35 v v cc = 6.0 v - 2.8 1.8 - 1.8 - 1.8 v v oh high-level output voltage v i = v ih or v il i o = ? 20 a; v cc = 2.0 v 1.9 2.0 - 1.9 - 1.9 - v i o = ? 20 a; v cc = 4.5 v 4.4 4.5 - 4.4 - 4.4 - v i o = ? 20 a; v cc = 6.0 v 5.9 6.0 - 5.9 - 5.9 - v i o = ? 4.0 ma; v cc = 4.5 v 3.98 4.32 - 3.84 - 3.7 - v i o = ? 5.2 ma; v cc = 6.0 v 5.48 5.81 - 5.34 - 5.2 - v v ol low-level output voltage v i = v ih or v il i o = 20 a; v cc = 2.0 v - 0 0.1 - 0.1 - 0.1 v i o = 20 a; v cc = 4.5 v - 0 0.1 - 0.1 - 0.1 v i o = 20 a; v cc = 6.0 v - 0 0.1 - 0.1 - 0.1 v i o = 4.0 ma; v cc = 4.5 v - 0.15 0.26 - 0.33 - 0.4 v i o = 5.2 ma; v cc = 6.0 v - 0.16 0.26 - 0.33 - 0.4 v i i input leakage current v i = v cc or gnd; v cc = 6.0 v - - 0.1 - 1 - 1 a i cc supply current v i = v cc or gnd; i o = 0 a; v cc = 6.0 v - - 8.0 - 80 - 160 a c i input capacitance - 3.5 - - - - - pf 74hct4020 v ih high-level input voltage v cc = 4.5 v to 5.5 v 2.0 1.6 - 2.0 - 2.0 - v v il low-level input voltage v cc = 4.5 v to 5.5 v - 1.2 0.8 - 0.8 - 0.8 v v oh high-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = ? 20 a 4.4 4.5 - 4.4 - 4.4 - v i o = ? 4.0 ma 3.98 4.32 - 3.84 - 3.7 - v v ol low-level output voltage v i = v ih or v il ; v cc = 4.5 v i o = 20 a; v cc = 4.5 v - 0 0.1 - 0.1 - 0.1 v i o = 4.0 ma; v cc = 4.5 v - 0.15 0.26 - 0.33 - 0.4 v i i input leakage current v i = v cc or gnd; v cc = 5.5 v - - 0.1 - 1 - 1 a
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 7 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter 11. dynamic characteristics i cc supply current v i = v cc or gnd; i o = 0 a; v cc = 5.5 v - - 8.0 - 80 - 160 a i cc additional supply current v i = v cc ? 2.1 v; i o = 0 a; other inputs at v cc or gnd; v cc = 4.5 v to 5.5 v pin mr - 110 396 - 495 - 539 a pin cp - 85 306 - 383 - 417 a c i input capacitance - 3.5 - - - - - pf table 6. static characteristics ?continued at recommended operating conditions; voltag es are referenced to gnd (ground = 0 v). symbol parameter conditions 25 c ? 40 c to +85 c ? 40 c to +125 c unit min typ max min max min max table 7. dynamic characteristics gnd (ground = 0 v); c l = 50 pf unless otherwise specified; for test circuit, see figure 10 symbol parameter conditions 25 c ? 40 c to +85 c ? 40 c to +125 c unit min typ max min max min max 74hc4020 t pd propagation delay cp to q0; see figure 8 [1] v cc = 2.0 v; c l = 50 pf - 39 140 - 175 - 210 ns v cc = 4.5 v; c l = 50 pf - 14 28 - 35 - 42 ns v cc = 5.0 v; c l = 15 pf - 11 - - - - - ns v cc = 6.0 v; c l = 50 pf - 11 24 - 30 - 36 ns qn to qn+1; see figure 9 v cc = 2.0 v; c l = 50 pf - 22 75 - 95 - 110 ns v cc = 4.5 v; c l = 50 pf - 8 15 - 19 - 22 ns v cc = 5.0 v; c l = 15 pf - 6 - - - - - ns v cc = 6.0 v; c l = 50 pf - 6 13 - 16 - 19 ns t phl high to low propagation delay mr to qn; see figure 8 v cc =2.0 v; c l = 50 pf - 55 170 - 215 - 225 ns v cc = 4.5 v; c l = 50 pf - 20 34 - 43 - 51 ns v cc = 5.0 v; c l = 15 pf - 17 - - - - - ns v cc = 6.0 v; c l = 50 pf - 16 29 - 37 - 43 ns t t transition time qn; see figure 8 [2] v cc = 2.0 v; c l = 50 pf - 19 75 - 95 - 110 ns v cc = 4.5 v; c l = 50 pf - 7 15 - 19 - 22 ns v cc = 6.0 v; c l = 50 pf - 6 13 - 16 - 19 ns
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 8 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter t w pulse width cp high or low; see figure 8 v cc = 2.0 v; c l = 50 pf 80 14 - 100 - 120 - ns v cc = 4.5 v; c l = 50 pf 16 4 - 20 - 24 - ns v cc = 6.0 v; c l = 50 pf 14 3 - 17 - 20 - ns mr high; see figure 8 v cc = 2.0 v; c l = 50 pf 80 17 - 100 - 120 - ns v cc = 4.5 v; c l = 50 pf 16 6 - 20 - 24 - ns v cc = 6.0 v; c l = 50 pf 14 5 - 17 - 20 - ns t rec recovery time mr to cp ; see figure 8 v cc = 2.0 v; c l = 50 pf 50 6 - 65 - 75 - ns v cc = 4.5 v; c l = 50 pf 10 2 - 13 - 15 - ns v cc = 6.0 v; c l = 50 pf 9 2 - 11 - 13 - ns f max maximum frequency see figure 8 v cc = 2.0 v; c l = 50 pf 6.0 30 - 4.8 - 4.0 - mhz v cc = 4.5 v; c l = 50 pf 30 92 - 24 - 20 - mhz v cc = 5.0 v; c l = 15 pf - 101 - - - - - mhz v cc = 6.0 v; c l = 50 pf 35 109 - 28 - 24 - mhz c pd power dissipation capacitance [3] - 19 - - - - - pf 74hct4020 t pd propagation delay cp to q0; see figure 8 [1] v cc = 4.5 v; c l = 50 pf - 18 36 - 45 - 54 ns v cc = 5.0 v; c l = 15 pf - 15 - - - - - ns qn to qn+1; see figure 9 v cc = 4.5 v; c l = 50 pf - 8 15 - 19 - 22 ns v cc = 5.0 v; c l = 15 pf - 6 - - - - - ns t phl high to low propagation delay mr to qn; see figure 8 v cc = 4.5 v; c l = 50 pf - 22 45 - 56 - 68 ns v cc = 5.0 v; c l = 15 pf - 19 - - - - - ns t t transition time qn; see figure 8 [2] v cc = 4.5 v; c l = 50 pf - 7 15 - 19 - 22 ns t w pulse width cp high or low; see figure 8 v cc = 4.5 v; c l = 50 pf 20 7 - 25 - 30 - ns mr high; see figure 8 v cc = 4.5 v; c l = 50 pf 20 8 - 25 - 30 - ns t rec recovery time mr to cp ; see figure 8 v cc = 4.5 v; c l = 50 pf 10 2 - 13 - 15 - ns table 7. dynamic characteristics ?continued gnd (ground = 0 v); c l = 50 pf unless otherwise specified; for test circuit, see figure 10 symbol parameter conditions 25 c ? 40 c to +85 c ? 40 c to +125 c unit min typ max min max min max
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 9 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter [1] t pd is the same as t phl and t plh . [2] t t is the same as t thl and t tlh . [3] c pd is used to determine the dynamic power dissipation (p d in w). p d = c pd v cc 2 f i + (c l v cc 2 f o ) where: f i = input frequency in mhz; f o = output frequency in mhz; (c l v cc 2 f o ) = sum of outputs; c l = output load capacitance in pf; v cc = supply voltage in v. 12. waveforms f max maximum frequency see figure 8 v cc = 4.5 v; c l = 50 pf 25 47 - 20 - 17 - mhz v cc = 5.0 v; c l = 15 pf - 52 - - - - - mhz c pd power dissipation capacitance [3] - 20 - - - - - pf table 7. dynamic characteristics ?continued gnd (ground = 0 v); c l = 50 pf unless otherwise specified; for test circuit, see figure 10 symbol parameter conditions 25 c ? 40 c to +85 c ? 40 c to +125 c unit min typ max min max min max measurement points are given in table 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 8. clock ( cp ) to output (qn) propagation delays, clock pulse width, output transition times, maximum clock pulse frequency, master reset (mr) pulse width, ma ster reset to output (qn) propagation delays and master reset to clock ( cp ) recovery time mr input cp input q0 or qn output t w t phl 1/f max t rec v m v i v i v m 001aad59 0 t plh t w t tlh t thl t phl v m
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 10 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter measurement points are given in table 8 . v ol and v oh are typical voltage output levels that occur with the output load. fig 9. waveforms showing the output qn to output qn+1 propagation delays 001aai12 0 qn output t plh t phl v oh v oh v ol v ol v m v m qn+1 output table 8. measurement points type input output v m v m 74hc4020 0.5 v cc 0.5 v cc 74hct4020 1.3 v 1.3 v
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 11 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter test data is given in table 9 . definitions test circuit: r t = termination resistance should be equal to output impedance z o of the pulse generator. c l = load capacitance including jig and probe capacitance. fig 10. test circuit for measuring switching times 001aah7 68 t w t w t r t r t f v m v i negative pulse gnd v i positive pulse gnd 10 % 90 % 90 % 10 % v m v m v m t f v cc dut r t v i v o c l g table 9. test data type input load v i t r , t f c l 74hc4020 v cc 6 ns 15 pf, 50 pf 74hct4020 3 v 6 ns 15 pf, 50 pf
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 12 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter 13. package outline fig 11. package outline sot38-4 (dip16) references outline version european projection issue date iec jedec jeita sot38-4 95-01-14 03-02-13 m h c (e ) 1 m e a l seating plane a 1 w m b 1 b 2 e d a 2 z 16 1 9 8 e pin 1 index b 0 5 10 mm scale note 1. plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. unit a max. 12 b 1 (1) (1) (1) b 2 cd e e m z h l mm dimensions (inch dimensions are derived from the original mm dimensions) a min. a max. b max. w m e e 1 1.73 1.30 0.53 0.38 0.36 0.23 19.50 18.55 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 0.76 4.2 0.51 3.2 inches 0.068 0.051 0.021 0.015 0.014 0.009 1.25 0.85 0.049 0.033 0.77 0.73 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.03 0.17 0.02 0.13 d ip16: plastic dual in-line package; 16 leads (300 mil) sot38 -4
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 13 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter fig 12. package outline sot109-1 (so16) x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale s o16: plastic small outline package; 16 leads; body width 3.9 mm sot109 -1
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 14 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter fig 13. package outline sot338-1 (ssop16) unit a 1 a 2 a 3 b p cd (1) e (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm 0.21 0.05 1.80 1.65 0.25 0.38 0.25 0.20 0.09 6.4 6.0 5.4 5.2 0.65 1.25 7.9 7.6 1.03 0.63 0.9 0.7 1.00 0.55 8 0 o o 0.13 0.2 0.1 dimensions (mm are the original dimensions) note 1. plastic or metal protrusions of 0.25 mm maximum per side are not included. sot338-1 99-12-27 03-02-19 (1) w m b p d h e e z e c v m a x a y 1 8 16 9 a a 1 a 2 l p q detail x l (a ) 3 mo-150 pin 1 index 0 2.5 5 mm scale s sop16: plastic shrink small outline package; 16 leads; body width 5.3 mm sot338 -1 a max. 2
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 15 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter fig 14. package outline sot403-1 (tssop16) unit a 1 a 2 a 3 b p cd (1) e (2) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 5.1 4.9 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.40 0.06 8 0 o o 0.13 0.1 0.2 1 dimensions (mm are the original dimensions) notes 1. plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 sot403-1 mo-153 99-12-27 03-02-18 w m b p d z e 0.25 18 16 9 a a 1 a 2 l p q detail x l (a ) 3 h e e c v m a x a y 0 2.5 5 mm scale tssop16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm sot403 -1 a max. 1.1 pin 1 index
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 16 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter fig 15. package outline sot763-1 (dhvqfn16) terminal 1 index area 0.5 1 a 1 e h b unit y e 0.2 c references outline version european projection issue date iec jedec jeita mm 3.6 3.4 d h 2.15 1.85 y 1 2.6 2.4 1.15 0.85 e 1 2.5 0.30 0.18 0.05 0.00 0.05 0.1 dimensions (mm are the original dimensions) sot763-1 mo-241 - - - - - - 0.5 0.3 l 0.1 v 0.05 w 0 2.5 5 mm scale sot763 -1 d hvqfn16: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 1 6 terminals; body 2.5 x 3.5 x 0.85 mm a (1) max. a a 1 c detail x y y 1 c e l e h d h e e 1 b 27 15 10 9 8 1 16 x d e c b a terminal 1 index area a c c b v m w m e (1) note 1. plastic or metal protrusions of 0.075 mm maximum per side are not included. d (1) 02-10-17 03-01-27
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 17 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter 14. abbreviations 15. revision history table 10. abbreviations acronym abbreviation cmos complementary metal oxide semiconductor dut device under test table 11. revision history document id release date data sheet status change notice supersedes 74hc_hct4020_3 20100120 product data sheet - 74hc_hct4020_cnv_2 modifications: ? the format of this data sheet has been redesigned to comply with the new identity guidelines of nxp semiconductors. ? legal texts have been adapted to the new company name where appropriate. ? added type number 74hc4020bq, 74HCT4020BQ (dhvqfn16 / sot763-1 package). ? reference to family specifications is replaced by the actual information: section 4 ? ordering information ? , section 6 ? pinning information ? , section 8 ? limiting values ? , section 9 ? recommended operating conditions ? , section 10 ? static characteristics ? , figure 10 ? test circuit for measuring switching times ? 74hc_hct4020_cnv_2 19970901 product specification - -
74hc_hct4020_3 ? nxp b.v. 2010. all rights reserved. product data sheet rev. 03 ? 20 january 2010 18 of 19 nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 16.3 disclaimers general ? information in this document is believed to be accurate and reliable. however, nxp semiconductors d oes not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. exposure to limiting values for extended periods may affect device reliability. terms and conditions of sale ? nxp semiconductors products are sold subject to the general terms and condit ions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writ ing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objec tive specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
nxp semiconductors 74hc4020; 74hct4020 14-stage binary ripple counter ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 20 january 2010 document identifier: 74hc_hct4020_3 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 4 ordering information . . . . . . . . . . . . . . . . . . . . . 1 5 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 functional description . . . . . . . . . . . . . . . . . . . 4 7.1 timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 recommended operating conditions. . . . . . . . 5 10 static characteristics. . . . . . . . . . . . . . . . . . . . . 6 11 dynamic characteristics . . . . . . . . . . . . . . . . . . 7 12 waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 18 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 18 17 contact information. . . . . . . . . . . . . . . . . . . . . 18 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19


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